PCB Board Reverse Engineering Test Structures
PCB Board Reverse Engineering Test structures described are intended for determining trace characteristic impedance and propagation velocity. Increasing bus design speeds require improved impedance and coupling control to maintain timing. This means careful attention to bus design trace geometries after PCBA Cloning must be accounted for in order to develop proper test coupons. The following sections provide recommendations for test coupon designs.
Test structures of PWB Cloning should allow you to extract impedance and velocity characteristics that represent actual traces in the bus layout. To represent the characteristic impedance and the design accurately, test coupons must follow bus layout guidelines, including trace to trace spacing and ground shielding. Bus designs like the RDRAM channel depart from typical designs by operating in pipeline mode to provide data rates up to 800MT/s from PCB Reverse engineering.
Sensitivity to trace impedance matching and coupling need to be minimized to reduce affects like inter symbol interference (ISI). Implementing ground shields or floods between signal traces reduces trace to trace parasitic coupling. Improved trace to trace impedance control is achieved by inserting ground shields in between signal lines from Circuit Board cloning. This provides the same copper density across the bus to insure etch characteristics are equivalent for all signal lines. These ground shields, important to note, also add capacitive coupling to ground which affect the trace characteristic impedance.
Test structures without dummy traces or floods will both not represent the actual bus characteristic impedance and will exhibit more etch variation (thus, more Zo variation) in the coupon than the actual bus.
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