Printed Wiring Board Layout Cloning

Printed Wiring Board Layout Cloning include PCB board documents extraction, schematic diagram, gerber file, and BOM file can be restored from physical circuit board samples;

Printed Wiring Board Layout Cloning include PCB board documents extraction, schematic diagram, gerber file, and BOM file can be restored from physical circuit board samples
Printed Wiring Board Layout Cloning include PCB board documents extraction, schematic diagram, gerber file, and BOM file can be restored from physical circuit board samples

For most of the Printed circuit board cloning with multiple layers, having ground fill on the ground layer of external environment or ground layer to control the electro-magnetic radiation and sensitivity of electro-magnetic interference can be used several times.

And extra power supply layer and ground layer can be added; as long as there is no paired signal layers among the two power supply layers. High speed printed wiring board cloning’s layout can be arranged within a same signal layer; except the SMT components connection issue which is compelled to break this rule. All of track layout for one kind of signal must have the common revert route.

Ensure the reverting signals could exactly identical to one another in the equal distance of locations. Which means the signals line should layout symmetrically along the two sides of ground line. one of most advanced point for this operation is control the impedance and route; the drawback of this way is there will be too much through holes on the ground layer and some of the useless layers.

Two signal layers which has adjacent layout, the advantage is the quantity of through holes in the ground layer can be maintained within the minimum level (use buried vias); the drawback is the effectiveness of this method could be decreased for some printed wiring board cloning. Hereby we would like to recommend the second method, since the component driving and signal reception on the ground layer should connect to the adjacent layer which connect to signal layer when cloning printed wiring board. as a simple layout principle, the track width on the top layer should as small as possible.


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