Reverse Engineering Printed Circuit Board Component Placement

Place the components properly when reverse engineering printed circuit board

The inappropriate arrangement of components on the pcb is a important factor for interference, so the thorough consideration must be given for the printed circuit board structure, place the components properly when reverse engineering printed circuit board. First of all, the shape and dimension of printed circuit board must be considered, if the over-size can cause the extremely long tracks, which will increase the impedance values on the printed circuit board and decrease the noise capacitance; if too small size is not good to dissipate the heat generated from the process of printed circuit board reverse engineering, adjecent wire and components is more likely to have sensibility issue when reverse engineering printed circuit board.

Layout the logic circuit on the printed circuit board, in principle, the high speed circuit must be placed on the area where is close to the input terminals, such as optical-electrical isolator. Etc, and place the low speed circuit and memory in the remote areas when reverse engineering printed circuit board for the convenience of common impedance coupling, radiation and cross-talk issues. Place the buffer device on the input/output when printed circuit board reverse engineering can prevent the noice interference among printed circuit Boards which used for the signal conveying. Whe there are components with large power consumption, and high voltage on the printed circuit board, certain distance must be kept among with other components with low voltage and power and layout them separately as much as possible in the process of Printed Circuit Board Reverse Engineering. It is better not place components with large power and voltage/current among them with thermo-sensitive parts or run the amplifier, to avoid the sensation or temperature floating;

 


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