Printed Circuit Board Layout Cloning

Printed Circuit Board Layout Cloning is a process to place electronic components on the PCB board design drawing which has been created through schematic diagram, the re-layout is to put electronic components on the circuit board. At this time, if all the preparations mentioned above are done, you can generate it on the schematic Netlist (Design->Create Netlist), and then import the netlist (Design->Load Nets) on the PCB diagram.

Printed Circuit Board Layout Cloning is a process to place electronic components on the PCB board design drawing which has been created through schematic diagram
Printed Circuit Board Layout Cloning is a process to place electronic components on the PCB board design drawing which has been created through schematic diagram

Just saw The devices are all piled up, and there are flying wires between the pins to indicate the connection. Then you can re-layout printed wiring board design. General layout press need to be proceeded with the following principles:

1. According to the reasonable division of electrical performance, it is generally divided into: digital circuit area (that is, afraid of interference and interference), analog circuit area (fear of interference), power drive area (interference source);

According to the reasonable division of electrical performance, it is generally divided into: digital circuit area (that is, afraid of interference and interference), analog circuit area (fear of interference), power drive area (interference source)
According to the reasonable division of electrical performance, it is generally divided into: digital circuit area (that is, afraid of interference and interference), analog circuit area (fear of interference), power drive area (interference source)

2. Circuits that complete the same function should be placed as close as possible, and the components should be adjusted to ensure the most concise connection; at the same time, adjust the relative position between the functional blocks to make the connection;

3. For high-quality components, the installation location and installation strength should be considered; heating components should be placed separately from temperature-sensitive components, and heat convection measures should be considered when necessary;