High Speed PCB Board Reverse Engineering Electro-magnetic Radiation Detection Technology

In the process of High Speed PCB Board Reverse Engineering Electro-magnetic Radiation Detection, Currently most of the hardware engineers reverse engineering the PCB board according to experience, in the process of debugging, most of the detecting signal line or micro-controller pin-outs have been embedded into the PCB board interlayer when reverse engineering it and can’t be detect by the oscillograph, if the PCB board fail to pass the functional test, there is no effective way to figure out the reason.

If we want to validate the EMC features, we can only bring the PCB board into the standard electro-magnetic detecting room for measurement, since this way can only detect external radiation but it can still provide limited effective information through which the engineers can repair and modify the Layout, Gerber file and Schematic diagram according to experience and repeat it. This is a very expensive way which will delay the launch cycle of PCB board;

There are a lot of high speed PCB board analysis and simulation reverse engineering tools which can help engineers solve the problems, but there is a lot of limitations on the component model, such as lots of IBIS model which can help to solve the signal integrity stimulation of PCB Board reverse engineering don’t have models or the models is not precise.

SPICE models must be applied if EMC need to stimulate precisely, but currently almost no ASIC of PCB board reverse engineering can provide SPICE models. At the same time, EMC simulation can’t take the radiation of its own into account. Since the component radiation is much greater than radiation on the transmitting wire.

Moreover, simulation tools of PCB Reverse Engineering will normally has lower expectation on the preciseness and time length, the better performance you expect, the longer time it will take, as a result of that, simulation tools can’t address the interference issue completely.

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