Double Side PCB Reverse Engineering Anti-ESD Measures

For Double Side PCB Reverse Engineering Anti-ESD, tightly interleaved power and ground grids are used. The power cord is close to the ground, and should be connected as much as possible between the vertical and horizontal lines or the fill area. The grid size on one side is less than or equal to 60mm. If possible, the grid size should be less than 13mm. Make sure that each circuit is as compact as possible.

Put all connectors aside as much as possible, if possible, route the power cord from the center of the card away from areas that are susceptible to direct ESD. Place a wide chassis or polygon fill on all PCB layers underneath the connector (which is easily hit directly by the ESD) and connect them with vias every 13mm apart.

A mounting hole is placed on the edge of the card, and the top and bottom pads of the solderless solder are attached to the chassis ground. When assembling the PCB, do not apply any solder to the top or bottom pads. Use screws with in-line washers to achieve close contact between the PCB and the metal chassis/shield or ground plane bracket.

Between the chassis ground and circuit ground of each layer, the same “isolation zone” should be set through Double Side PCB Reverse Engineering; if possible, keep the separation distance 0.64mm. At the top and bottom of the card close to the mounting hole, every 100mm along the chassis, The wires connect the chassis ground and the circuit ground with a 1.27 mm wide wire.

Adjacent to these connection points, pads or mounting holes for mounting are placed between the chassis ground and the circuit ground. These ground connections can be made with a blade to keep open or jump with magnetic beads/high frequency capacitors.