Definition of Vias from Printed Circuit Board Reverse Engineering

In the process of Printed Circuit Board Reverse Engineering , there is a very important role for connecting the circuit tracks on various layers, there is a shared hole on the interconnecting area of each layer which can be viewed as through hole,

and theoretically speaking manufacturer just immerse a thin layer of metal on the hole wall of the through vias by the chemical immersion method, through which the copper foil of each of the internal layers can be connected together by it and the soldering pad shape will be made with round on the top and bottom layer (each end of the through hole route) and make direct connection with the circuit tracks of top and bottom layer.

General Speaking, there is below rules for PCB Reverse Engineering:

first is Choose the through vias as least as possibl, since once through hole has been chosen, take good care of their space among other objects around it, especially for the internal layers which are more likely to be ignored and the space between tracks which don’t connect with vias with other vias, and if the layout is performed by automatically, engineer can choose the selection by turn on the option of VIA MINIMIZATION in the sub-colomn;

second is the higher overload stream it need to take, and corresponding via size will need to expand, such as the power supply plane and other layers which are connected with them must larger than original one.

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