Printed Circuit Board Replicating EDA Tool

Printed Circuit Board Replicating EDA Tool is commonly used in the PCB reverse engineering technology, the mastering skill of EDA tool will help to greatly improve the working efficiency of copying electronic pcb board gerber file;

Printed Circuit Board Replicating EDA Tool is commonly used in the PCB reverse engineering technology, the mastering skill of EDA tool will help to greatly improve the working efficiency of copying electronic pcb board gerber file
Printed Circuit Board Replicating EDA Tool is commonly used in the PCB reverse engineering technology, the mastering skill of EDA tool will help to greatly improve the working efficiency of copying electronic pcb board gerber file

Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards.

In the process of printed circuit board replicating, although the EDA tool has become much strong than before in the field of printed circuit board replicating, according with the decreasing size of printed circuit board, as well as the more density of electronic components, the difficulty of printed circuit card duplicating is higher than before also.

In order to solve the difficulty engineer will encounter, and speed up the product launching time frame, now, more and more engineer intend to use dedicated EDA tools to proceed the PCBA duplicating. However, the dedicated EDA tools won’t be able to generate the ideal conditions and it is also difficult to achieve the 100% yield rate plus the mess up of circuit tracks layout which normally will require more time to complete the abundant work.

Confirm the printed circuit board layer count before replicating, the dimension and layer count of printed circuit board must be fixed in the preliminary stage, if the ball grid array has been applied in the pwb reverse engineering, then it is necessary to consider the minimum layer count will be required for the component layout and arrangement. The quantity of layer count and stack up method will affect the PCB layout design and impedance directly. And the dimension of printed circuit board can help to determine the stack up way and track width to achieve the expected result.


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