PCB Reverse Engineering Initial Inspection Testing

PCB Reverse Engineering Initial Inspection Testing should basic include two steps:

First is Post-shipment inspection, which is extremely critical for subsequent PCB reverse engineering. The main purpose of post shipment inspection is to preclude the replication of defects, the pcb sample provided for reverse engineering should be inspected for possible damage in shipment.

Although we will normally suggest customers to choose reliable courior like UPS, FEDEX or DHL to ship the sample. In case the sample has any damage from transportation, damage Reports or Failed Item Reports should be generated as required. An initial operating test should be performed to ensure the printed circuit board functions in accordance with established performance specifications.

Second step is Pre-disassembly photographs, The printed circuit board sample should be photographed prior to and during PCB Board disassembly since, in some cases, no other record of the item exists. In addition, since the piece-parts will be identified by bagging and tagging, their position in the assembly should be noted. For pcb sample, we will at least photograph from TOP and BOTTOM side separately, and normally more photos will be taken like from the edge side and partial side to give an enlarge image on those needed area.

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