PCB Board Reverse Engineering Measurement

The TDR method of PCB Board Reverse Engineering Measurement provides a simple means for determining PCB impedance and propagation delay characteristics. However, the actual data extraction from a test structure can be highly dependent on cursor positioning on the TDR pulse.

This section outlines the general instrument setup to obtain accurate results independent of probe type and test structure for velocity measurement in PCB Board Reverse Engineering.

Display adjustment should be completed to maximize measurement accuracy. The horizontal and vertical adjustments should be adjusted under probing Conditions.

The general recommendation is to continue adjusting both horizontal and vertical scaling until the launch edge is aligned with the first column and the reflected edge is aligned with the last. The vertical scaling should be adjusted to maximize ~50% of the screen between launch ledge and line under test for high speed PCB Board Reverse Engineering. Screen should look similar to figure 13 under probing conditions for lower than 50Ω measurements.

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