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Flextronics expands Silicon Valley Product Innovation Center

Flextronics held a ribbon cutting ceremony to commemorate the company’s expanded Silicon Valley Product Innovation Center (PIC) in Milpitas, California.
As announced last year, the Center houses advanced 3D plastic printing, Surface Mount Technology (SMT), X-ray and test equipment.

Now, the Company unveiled its most recent enhancements to the PIC, including the modernization of all production line equipment, the addition of 3D metal printing, and the development of a workspace for Lab IX, Flextronics’ new startup accelerator program. Lab IX is working with the next generation of hardware startup companies and innovators, helping them take their disruptive technologies from prototype to manufacturing.

Flextronics has also enhanced the Center’s microelectronics packaging, assembly process technologies, created a reliability and failure analysis lab and created a dedicated automation applications team.

“We have invested more than USD 40 million dollars to date in this 600,000 square-foot campus that supports major industries in bringing innovative products to market rapidly in a confidential environment,” said Mike McNamara, CEO of Flextronics. “Our investment in this facility underscores our commitment to our customers’ success and providing end to end supply chain solutions that enable and scale innovation.”

Read more: http://evertiq.com/news/33603